Invention Grant
- Patent Title: Multi-layer gate dielectric field-effect transistor and manufacturing process thereof
- Patent Title (中): 多层栅介质场效应晶体管及其制造方法
-
Application No.: US13877441Application Date: 2011-10-05
-
Publication No.: US09368737B2Publication Date: 2016-06-14
- Inventor: Do Kyung Hwang , Jungbae Kim , Canek Fuentes-Hernandez , Bernard Kippelen
- Applicant: Do Kyung Hwang , Jungbae Kim , Canek Fuentes-Hernandez , Bernard Kippelen
- Applicant Address: US GA Atlanta
- Assignee: Georgia Tech Research Corporation
- Current Assignee: Georgia Tech Research Corporation
- Current Assignee Address: US GA Atlanta
- Agency: Pabst Patent Group LLP
- International Application: PCT/US2011/054989 WO 20111005
- International Announcement: WO2012/048048 WO 20120412
- Main IPC: H01L35/24
- IPC: H01L35/24 ; H01L51/05 ; H01L51/00

Abstract:
A field-effect transistor includes a gate, a source and a drain; a semiconductor layer between the source and the drain; and a gate insulator between the gate and the semiconductor layer. The gate insulator comprises a first layer adjoining the semiconductor layer; and a second layer. The first layer is formed from an amorphous fluoropolymer having a first dielectric constant and a first thickness. The second layer has a second dielectric constant and a second thickness. The first dielectric constant is smaller than 3, the first thickness is smaller than 200 nm, the second dielectric constant is higher than 5, and the second thickness is smaller than 500 nm.
Public/Granted literature
- US20130270534A1 FIELD-EFFECT TRANSISTOR AND MANUFACTURING PROCESS THEREOF Public/Granted day:2013-10-17
Information query
IPC分类: