Invention Grant
- Patent Title: Potting compound chamber designs for electrical connectors
- Patent Title (中): 灌封复合室设计用于电连接器
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Application No.: US14337985Application Date: 2014-07-22
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Publication No.: US09368905B2Publication Date: 2016-06-14
- Inventor: Adam Douglas Ledgerwood , Alvah Benjamin Aldrich , Joseph Michael Manahan
- Applicant: Adam Douglas Ledgerwood , Alvah Benjamin Aldrich , Joseph Michael Manahan
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: King & Spalding LLP
- Main IPC: H01R13/40
- IPC: H01R13/40 ; H01R13/52 ; H01R13/527

Abstract:
An electrical chamber is disclosed herein. The electrical chamber can include at least one wall forming a cavity, where the at least one wall includes a first end and an inner surface. The electrical chamber can also include a first isolation zone disposed on the inner surface at a first distance from the first end, where the first isolation zone is formed by a first bridge, a first underhang, and a first isolation zone inner surface, where the first bridge protrudes inward toward the cavity from the inner surface, and where the first underhang extends from a distal end of the first bridge. The cavity can be configured to receive at least one electrical conductor. The cavity and the first isolation zone can be configured to receive a potting compound.
Public/Granted literature
- US20160028182A1 POTTING COMPOUND CHAMBER DESIGNS FOR ELECTRICAL CONNECTORS Public/Granted day:2016-01-28
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