Invention Grant
- Patent Title: Hybrid quantum circuit assembly
- Patent Title (中): 混合量子电路组件
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Application No.: US14290457Application Date: 2014-05-29
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Publication No.: US09369133B2Publication Date: 2016-06-14
- Inventor: Ofer Naaman , Anthony Joseph Przybysz , Rupert M. Lewis , Steven L. Sendelbach
- Applicant: Ofer Naaman , Anthony Joseph Przybysz , Rupert M. Lewis , Steven L. Sendelbach
- Applicant Address: US VA Falls Church
- Assignee: Northrop Grumman Systems Corporation
- Current Assignee: Northrop Grumman Systems Corporation
- Current Assignee Address: US VA Falls Church
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Main IPC: H03K19/195
- IPC: H03K19/195 ; B82Y10/00 ; G06N99/00
Abstract:
Systems and methods are provided for a hybrid qubit circuit assembly is provided. A first plural set of Josephson junctions is arranged in series on a first path between two nodes of a circuit. A second plural set of Josephson junctions is arranged in parallel with one another to form a direct current superconducting quantum interference device (DC SQUID). The DC SQUID is in parallel with the first plural set of Josephson junctions. A capacitor is in parallel with each of the first plural set of Josephson junctions and the DC SQUID.
Public/Granted literature
- US20150349780A1 HYBRID QUANTUM CIRCUIT ASSEMBLY Public/Granted day:2015-12-03
Information query
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