Invention Grant
- Patent Title: Low EMI signaling for parallel conductor interfaces
- Patent Title (中): 低EMI信号用于并行导体接口
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Application No.: US14612245Application Date: 2015-02-02
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Publication No.: US09369312B1Publication Date: 2016-06-14
- Inventor: Amin Shokrollahi , Nicolae Chiurtu
- Applicant: Kandou Labs SA
- Applicant Address: CH
- Assignee: KANDOU LABS, S.A.
- Current Assignee: KANDOU LABS, S.A.
- Current Assignee Address: CH
- Agency: Invention Mine LLC
- Main IPC: H04B3/00
- IPC: H04B3/00 ; H04L25/02 ; H04L1/00

Abstract:
Methods are disclosed for creation of vector signaling codes having reduced or minimized electromagnetic emissions when transmitted over multiple conductor communications media such as microstrip channels. Particular code formulation constraints are shown to correlate with physical propagation characteristics leading to beneficial cancellation of far fields from adjacent signal conductors, and the number of such constraints may be chosen to balance EMI characteristics with information encoding capacity in the resulting code.
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