Invention Grant
- Patent Title: Microstructure plating systems and methods
- Patent Title (中): 微结构电镀系统及方法
-
Application No.: US13839923Application Date: 2013-03-15
-
Publication No.: US09371222B2Publication Date: 2016-06-21
- Inventor: Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G01D11/00
- IPC: G01D11/00 ; B81C1/00
Abstract:
Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Public/Granted literature
- US20140260710A1 ULTRASOUND LIQUID DISPERSION HUMIDIFIER Public/Granted day:2014-09-18
Information query
