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US09371579B2 Ground state hydrogen radical sources for chemical vapor deposition of silicon-carbon-containing films 有权
用于化学气相沉积含硅碳膜的基态氢根源

Ground state hydrogen radical sources for chemical vapor deposition of silicon-carbon-containing films
Abstract:
A thin layer of a silicon-carbon-containing film is deposited on a substrate by generating hydrogen radicals from hydrogen gas supplied to a radicals generation chamber, supplying the hydrogen radicals to a substrate processing chamber separate from the substrate processing chamber via a multiport gas distributor, and reacting the hydrogen radicals therein with an organosilicon reactant introduced into the substrate processing chamber concurrently. The hydrogen radicals are allowed to relax into a ground state in a radicals relaxation zone within the substrate processing chamber before reacting with the organosilicon reactant.
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