Invention Grant
- Patent Title: Signal line path and manufacturing method therefor
- Patent Title (中): 信号线路径及其制造方法
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Application No.: US13343738Application Date: 2012-01-05
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Publication No.: US09374886B2Publication Date: 2016-06-21
- Inventor: Noboru Kato , Jun Sasaki
- Applicant: Noboru Kato , Jun Sasaki
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-164819 20090713
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; H05K3/02 ; H05K3/10 ; H05K1/02 ; H05K3/28 ; H05K3/46

Abstract:
A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer.
Public/Granted literature
- US20120097428A1 SIGNAL LINE PATH AND MANUFACTURING METHOD THEREFOR Public/Granted day:2012-04-26
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