Invention Grant
- Patent Title: Monolithic capacitor mounting structure and monolithic capacitor
- Patent Title (中): 单片电容器安装结构和单片电容器
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Application No.: US13960829Application Date: 2013-08-07
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Publication No.: US09374901B2Publication Date: 2016-06-21
- Inventor: Kazuo Hattori , Isamu Fujimoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-177638 20120810; JP2012-177639 20120810
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/30 ; H05K1/18 ; H01G2/06 ; H01G4/232 ; H05K3/34

Abstract:
In a monolithic capacitor mounting structure, assuming that a portion of a first outer electrode joined with a first bonding material is a first bonding portion and a portion of a second outer electrode joined with a second bonding material is a second bonding portion, a length of each of the first and second bonding portions in a lengthwise direction of the monolithic capacitor is about 0.2 times to about 0.5 times a length of an elementary body in the lengthwise direction, and a center of each of the first and second bonding portions in the lengthwise direction is located at a position different from a center of the elementary body in the lengthwise direction. Vibration noise is changed depending on positions of outer electrodes of the monolithic capacitor, the outer electrodes being used to bond the monolithic capacitor to a mounting substrate.
Public/Granted literature
- US20140041915A1 MONOLITHIC CAPACITOR MOUNTING STRUCTURE AND MONOLITHIC CAPACITOR Public/Granted day:2014-02-13
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