Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
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Application No.: US14409135Application Date: 2013-05-27
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Publication No.: US09379049B2Publication Date: 2016-06-28
- Inventor: Hiroki Ikeuchi
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: RatnerPrestia
- Priority: JP2012-150738 20120704
- International Application: PCT/JP2013/003338 WO 20130527
- International Announcement: WO2014/006814 WO 20140109
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/433 ; H01L23/64 ; H02M7/00 ; H01L23/373 ; H01L25/07 ; H01L23/31 ; H01L23/00 ; H01L25/18
Abstract:
The semiconductor apparatus includes: the first lead frame; the second lead frame; the second insulation resin which is disposed between the first lead frame and the second lead frame; the sealing resin which seals the semiconductor elements, the first lead frame and the second lead frame; the electric wiring part which electrically connects the semiconductor elements and the first lead frame; and the interlayer connecting part which electrically connects the first lead frame and the second lead frame.
Public/Granted literature
- US20150194372A1 SEMICONDUCTOR APPARATUS Public/Granted day:2015-07-09
Information query
IPC分类:
