Invention Grant
- Patent Title: Solid-state image pickup apparatus
- Patent Title (中): 固态摄像装置
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Application No.: US13545589Application Date: 2012-07-10
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Publication No.: US09379154B2Publication Date: 2016-06-28
- Inventor: Toshiaki Iwafuchi
- Applicant: Toshiaki Iwafuchi
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Hazuki International, LLC
- Priority: JP2011-163935 20110727
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L27/146
Abstract:
A solid-state image pickup apparatus including a substrate and a solid-state image pickup device. The substrate includes an opening portion. The solid-state image pickup device is mounted as a flip chip on a lower surface of the substrate on a circumference of the opening portion and receives and photo-electrically converts light that is taken in by a lens set on an upper surface of the substrate and enters from the opening portion. The circumference of the opening portion of the substrate is thinner than other portions of the substrate.
Public/Granted literature
- US20130026591A1 SOLID-STATE IMAGE PICKUP APPARATUS Public/Granted day:2013-01-31
Information query
IPC分类:
