Invention Grant
- Patent Title: Composite reconstituted wafer structures
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Application No.: US14341325Application Date: 2014-07-25
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Publication No.: US09379174B2Publication Date: 2016-06-28
- Inventor: Vlad Lenive , Simon Stacey
- Applicant: QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
- Applicant Address: GB Cambridge
- Assignee: QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
- Current Assignee: QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
- Current Assignee Address: GB Cambridge
- Agency: Procopio, Cory, Hargreaves & Savitch, LLP
- Priority: GB1217033.8 20120925
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L49/02 ; H01L27/04 ; H01L23/64 ; H01L23/00 ; H01L23/522 ; H01L23/28 ; H01L23/485 ; H01L23/13 ; H01L23/492 ; H01L23/498 ; H01L23/538 ; H01L23/66
Abstract:
A reconstituted electronic device comprising at least one die and at least one passive component. A functional material is incorporated in the substrate of the device to modify the electrical behavior of the passive component. The passive component may be formed in redistribution layers of the device. Composite functional materials may be used in the substrate to forms part of or all of the passive component. A metal carrier may form part of the substrate and part of the at least one passive component.
Public/Granted literature
- US20140332926A1 COMPOSITE RECONSTITUTED WAFER STRUCTURES Public/Granted day:2014-11-13
Information query
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