Invention Grant
US09379248B2 Thin-film transistor structure, as well as thin-film transistor and display device each having said structure
有权
薄膜晶体管结构,以及各自具有所述结构的薄膜晶体管和显示装置
- Patent Title: Thin-film transistor structure, as well as thin-film transistor and display device each having said structure
- Patent Title (中): 薄膜晶体管结构,以及各自具有所述结构的薄膜晶体管和显示装置
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Application No.: US14113303Application Date: 2012-04-19
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Publication No.: US09379248B2Publication Date: 2016-06-28
- Inventor: Takeaki Maeda , Toshihiro Kugimiya
- Applicant: Takeaki Maeda , Toshihiro Kugimiya
- Applicant Address: JP Kobe-shi
- Assignee: Kobe Steel, Ltd.
- Current Assignee: Kobe Steel, Ltd.
- Current Assignee Address: JP Kobe-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-096442 20110422
- International Application: PCT/JP2012/060576 WO 20120419
- International Announcement: WO2012/144556 WO 20121026
- Main IPC: H01L29/786
- IPC: H01L29/786 ; G02F1/1368 ; H01L27/12

Abstract:
There is provided an oxide semiconductor layer capable of making stable the electric characteristics of a thin-film transistor without requiring an oxidatively-treated layer when depositing a passivation layer or the like in display devices such as organic EL displays depositing and liquid crystal displays. The thin-film transistor structure of the present invention at least having, on a substrate, an oxide semiconductor layer, a source-drain electrode, and a passivation layer in order from the substrate side, wherein the oxide semiconductor layer is a stacked product of a first oxide semiconductor layer and a second oxide semiconductor layer; the first oxide semiconductor layer has a Zn content of 50 atomic % or more as a percentage of all metal elements contained therein, and the first oxide semiconductor layer is formed on the source-drain electrode and passivation layer side; the second oxide semiconductor layer contains at least one element selected from the group consisting of In, Ga, and Zn, and the second oxide semiconductor layer is formed on the substrate side; and the first oxide semiconductor layer is in direct contact both with the source-drain electrode and with the passivation layer.
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