Invention Grant
- Patent Title: Laminate sub-mounts for LED surface mount package
- Patent Title (中): 用于LED表面贴装的层压用底座
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Application No.: US14505557Application Date: 2014-10-03
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Publication No.: US09379298B2Publication Date: 2016-06-28
- Inventor: Justin Kolbe , Steve Taylor
- Applicant: HENKEL IP & HOLDING GMBH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent James J. Cummings
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/62 ; H01L33/60
Abstract:
An LED package is described that acts as a sub-mount between a printed circuit board and an LED. The sub-mount includes a laminate to thermally isolate the LED from the PCB while providing a thermal heat dissipative sink for the LED.
Public/Granted literature
- US20160099392A1 Laminate Sub-Mounts for LED Surface Mount Package Public/Granted day:2016-04-07
Information query
IPC分类:
