Invention Grant
US09379322B2 Highly reliable nonvolatile memory and manufacturing method thereof
有权
高度可靠的非易失性存储器及其制造方法
- Patent Title: Highly reliable nonvolatile memory and manufacturing method thereof
- Patent Title (中): 高度可靠的非易失性存储器及其制造方法
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Application No.: US14759624Application Date: 2013-09-30
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Publication No.: US09379322B2Publication Date: 2016-06-28
- Inventor: Ru Huang , Muxi Yu , Yimao Cai , Wenliang Bai , Yinglong Huang
- Applicant: Peking University
- Applicant Address: CN Beijing
- Assignee: Peking University
- Current Assignee: Peking University
- Current Assignee Address: CN Beijing
- Agency: Bozicevic, Field & Francis LLP
- Agent Bret E. Field; Rudy J. Ng
- Priority: CN201310049320 20130207
- International Application: PCT/CN2013/084761 WO 20130930
- International Announcement: WO2014/121618 WO 20140814
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L45/00 ; G11C13/00 ; H01L27/11

Abstract:
The present invention relates to a highly reliable nonvolatile memory and a manufacturing method thereof. The nonvolatile memory comprises top electrodes, bottom electrodes and a resistive material layer disposed therebetween, wherein the top electrodes are positioned on top in the memory; the bottom electrodes are positioned on a substrate; metal oxide for forming the resistive material layer is doped with metal; and a metal oxygen storage layer is further disposed between the top electrodes and the resistive material layer. The manufacturing method adopts a method in which a doping method and a double-layer forming method are combined, so that the highly reliable and highly uniform resistive random access memory can be fabricated and accordingly the performance of the memory can be increased.
Public/Granted literature
- US20150349253A1 Highly Reliable Nonvolatile Memory and Manufacturing Method Thereof Public/Granted day:2015-12-03
Information query
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