Invention Grant
- Patent Title: Compensation for length differences in vias associated with differential signaling
- Patent Title (中): 与差分信号相关的过孔长度差异的补偿
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Application No.: US14273167Application Date: 2014-05-08
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Publication No.: US09379424B2Publication Date: 2016-06-28
- Inventor: Yasuo Hidaka
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Maschoff Brennan
- Main IPC: H05K3/40
- IPC: H05K3/40 ; H01P3/08 ; G06F17/50 ; H01P11/00

Abstract:
A circuit may include a differential via that may include a first via having a first-via length and a second via having a second-via length longer than the first-via length. The circuit may also include a differential stripline coupled to the differential via. The differential stripline may include a first trace and a second trace that are broadside coupled to each other over at least a portion of the differential stripline to form a broadside coupled portion of the differential stripline. The first trace may be coupled to the first via and may have a first-trace length. The second trace may be coupled to the second via and may have a second-trace length. The broadside coupled portion of the differential stripline may be offset from a plane intersecting substantially half-way between the first via and the second via such that the second-trace length is shorter than the first-trace length.
Public/Granted literature
- US20150325901A1 COMPENSATION FOR LENGTH DIFFERENCES IN VIAS ASSOCIATED WITH DIFFERENTIAL SIGNALING Public/Granted day:2015-11-12
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