Invention Grant
- Patent Title: Connector and injection method for filler material
- Patent Title (中): 填充材料的连接器和注射方法
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Application No.: US14548698Application Date: 2014-11-20
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Publication No.: US09379480B2Publication Date: 2016-06-28
- Inventor: Akira Sato , Kazuhide Takahashi , Etsuro Suzuki , Kenji Takahashi
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP2012-140196 20120621
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R43/00 ; H01R43/24 ; H01R13/502

Abstract:
A connector includes a connector housing, an inner plate that supports a terminal connected to a one end portion of an electric wire and that is accommodated in an inside of the connector housing, and filler material that fills the inside of the connector housing which has accommodated the inner plate and that is then hardened so as to cover a connection part of the electric wire and the terminal. The filler material adheres to a first portion within an inner surface of the connector housing and to an outer surface of the inner plate. A release layer is provided between a second portion within the inner surface of the connector housing and an outer surface of the filler material opposite to the second portion.
Public/Granted literature
- US20150140848A1 CONNECTOR AND INJECTION METHOD FOR FILLER MATERIAL Public/Granted day:2015-05-21
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