Invention Grant
- Patent Title: Multilevel reactive power compensator
- Patent Title (中): 多电平无功补偿器
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Application No.: US14080456Application Date: 2013-11-14
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Publication No.: US09379548B2Publication Date: 2016-06-28
- Inventor: Yushi Koyama , Yosuke Nakazawa , Hiroshi Mochikawa , Atsuhiko Kuzumaki , Takeru Murao
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Baker Botts L.L.P.
- Priority: JP2012-251426 20121115
- Main IPC: H02M7/49
- IPC: H02M7/49 ; H02J3/18 ; H02M7/483

Abstract:
A reactive power compensator according to an embodiment comprises: multilevel inverter circuits respectively constituting each of the three phases; a filter circuit for reducing harmonics connected between the output terminals of each of the multilevel inverter circuits and a power system interconnection terminal; and a control section for causing prescribed three-phase AC voltage to be output by controlling each of said multilevel inverter circuits. Each of the multilevel inverter circuits is constituted by connecting in series one or more single-phase full-bridge single-pulse inverters and is arranged to convert DC voltage to respective positive and negative single-pulse voltages once per cycle of the fundamental wave of the voltage instruction value.
Public/Granted literature
- US20140133198A1 REACTIVE POWER COMPENSATOR Public/Granted day:2014-05-15
Information query
IPC分类: