Invention Grant
- Patent Title: Systems, methods, and apparatus for a power amplifier module
- Patent Title (中): 功率放大器模块的系统,方法和装置
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Application No.: US14071756Application Date: 2013-11-05
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Publication No.: US09379680B1Publication Date: 2016-06-28
- Inventor: Alexandros D. Margomenos , Miroslav Micovic , Ara K. Kurdoghlian , Ross L. Bowen
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Kwan & Olynick LLP
- Main IPC: H03F3/68
- IPC: H03F3/68 ; H03F3/60

Abstract:
Systems, methods, and apparatus are disclosed for wideband power amplification in a platform, such as an airplane. An amplifier module may include a first amplification stage. The first amplification stage may comprise a first plurality of amplification circuits. The amplifier module may also include a first plurality of couplers configured to couple an input port to each amplification circuit of the first amplification stage. The amplifier module may include a second amplification stage comprising a second plurality of amplification circuits. The amplifier module may also include a second plurality of couplers configured to couple the first amplification stage to the second amplification stage. The amplifier module may include a third plurality of couplers configured to combine an output of each amplification circuit of the second plurality of amplification circuits into an output signal. The third plurality of couplers may comprise one or more Lange couplers.
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