Invention Grant
US09380929B2 Endoscope with an optical member, a frame portion and a bonding member soldering the optical member to the frame portion
有权
具有光学构件，框架部分和将光学构件焊接到框架部分的接合构件的内窥镜
- Patent Title: Endoscope with an optical member, a frame portion and a bonding member soldering the optical member to the frame portion
- Patent Title (中): 具有光学构件，框架部分和将光学构件焊接到框架部分的接合构件的内窥镜
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Application No.: US14257536Application Date: 2014-04-21
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Publication No.: US09380929B2Publication Date: 2016-07-05
- Inventor: Atsushi Goto , Hiroaki Kinoshita
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenyon & Kenyon LLP
- Priority: JP2012-227265 20121012
- Main IPC: A61B1/06
- IPC: A61B1/06 ; A61B1/04 ; A61B1/00 ; G02B23/26 ; G02B23/24
Abstract:
An endoscope includes a lens, a lens frame that holds the lens, and a bonding member that water-tightly fixes the lens to the lens frame, the bonding member composed of Sn-alloy solder containing at least one of Zn, Sb, Al and In, having a melting point not higher than 200° C. and forming a chemical bond via oxygen, and the lens, the lens frame and the bonding member are provided at a distal end portion of an insertion portion.
Public/Granted literature
- US20140275786A1 ENDOSCOPE Public/Granted day:2014-09-18
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