Invention Grant
- Patent Title: Modular sensor platform
- Patent Title (中): 模块化传感器平台
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Application No.: US14101200Application Date: 2013-12-09
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Publication No.: US09380949B2Publication Date: 2016-07-05
- Inventor: James Schuessler
- Applicant: Samsung Electronics, Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Convergent Law Group LLP
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A61B5/0205 ; A61B5/0402 ; A61B5/053 ; A61B5/11

Abstract:
Exemplary embodiments for reconfiguring a storage system comprise a modular sensor platform, comprising: a base module comprising, a display, a processor, a memory and a communication interface; a band removably coupled to the base module such that the band is replaceable with different types of bands; and a sensor module that collects data from a user, the sensor module in communication with the base module and removably coupled to the band such that the sensor module is replaceable with different types of sensor modules, the sensor module further comprising a plurality of sensor units that are removably coupled to the sensor module such that individual sensor units are replaceable with different types of sensor units.
Public/Granted literature
- US20150160048A1 MODULAR SENSOR PLATFORM Public/Granted day:2015-06-11
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