Invention Grant
- Patent Title: Interspinous implant
- Patent Title (中): 椎间植入物
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Application No.: US12899079Application Date: 2010-10-06
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Publication No.: US09381047B2Publication Date: 2016-07-05
- Inventor: Garrett Austin Sheffer
- Applicant: Garrett Austin Sheffer
- Applicant Address: US NJ Parsippany
- Assignee: EBI, LLC
- Current Assignee: EBI, LLC
- Current Assignee Address: US NJ Parsippany
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: A61B17/70
- IPC: A61B17/70

Abstract:
An interspinous implant is provided. The interspinous implant can include a first member having a first end and a second end. At least one of the first end and the second end can include a mating portion. The interspinous implant can also include a second member, which can have a first end, a second end and at least one receiving portion formed adjacent to at least one of the first end and the second end. The at least one receiving portion can receive the mating portion to couple the first member to the second member at a desired orientation. The interspinous implant can also include a first extension, which can be substantially opposite the mating portion, and adapted to engage a spinous process. The interspinous implant can comprise a second extension, which can be substantially opposite the at least one receiving portion, and adapted to engage a second process.
Public/Granted literature
- US20110040330A1 INTERSPINOUS IMPLANT Public/Granted day:2011-02-17
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