Invention Grant
US09381614B2 Pressure regulator, polishing apparatus having the pressure regulator, and polishing method
有权
压力调节器,具有压力调节器的抛光装置和抛光方法
- Patent Title: Pressure regulator, polishing apparatus having the pressure regulator, and polishing method
- Patent Title (中): 压力调节器,具有压力调节器的抛光装置和抛光方法
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Application No.: US13948238Application Date: 2013-07-23
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Publication No.: US09381614B2Publication Date: 2016-07-05
- Inventor: Nobuyuki Takahashi , Toru Maruyama
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2012-162248 20120723
- Main IPC: B24B49/00
- IPC: B24B49/00 ; B24B37/34 ; B24B37/005 ; B24B7/22

Abstract:
A pressure regulator includes: a pressure-regulating valve configured to regulate pressure of a fluid supplied from a fluid supply source; a first pressure sensor configured to measure the pressure regulated by the pressure-regulating valve; a second pressure sensor located downstream of the first pressure sensor; a PID controller configured to produce a correction pressure command value for eliminating a difference between a pressure command value and a pressure value of the fluid measured by the second pressure sensor; and a regulator controller configured to control operation of the pressure-regulating valve so as to eliminate a difference between the correction pressure command value and a pressure value of the fluid measured by the first pressure sensor.
Public/Granted literature
- US20140087629A1 PRESSURE REGULATOR, POLISHING APPARATUS HAVING THE PRESSURE REGULATOR, AND POLISHING METHOD Public/Granted day:2014-03-27
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