Invention Grant
US09381662B2 Apparatus having scrap-guiding regions positioned on cutting assembly
有权
具有位于切割组件上的废料引导区域的设备
- Patent Title: Apparatus having scrap-guiding regions positioned on cutting assembly
- Patent Title (中): 具有位于切割组件上的废料引导区域的设备
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Application No.: US13653127Application Date: 2012-10-16
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Publication No.: US09381662B2Publication Date: 2016-07-05
- Inventor: William Moore
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Standley Law Group LLP
- Priority: CA2792162 20121012
- Main IPC: B26D7/18
- IPC: B26D7/18 ; B26D7/06 ; B26D1/09 ; B21D24/16 ; B21D45/00 ; B26D1/00 ; B23D31/00
Abstract:
An apparatus, comprising a cutting assembly being configured to cut an object, and scrap-guiding regions being positioned on opposite sides of the cutting assembly.
Public/Granted literature
- US20140102273A1 APPARATUS HAVING SCRAP-GUIDING REGIONS POSITIONED ON CUTTING ASSEMBLY Public/Granted day:2014-04-17
Information query
