A method for recycling adhesive-containing film waste. The film waste is initially coarsely chopped in a chopping device. A liquid or powdered additive that reduces the strength of the adhesive on the film waste is added to material in the chopping device or sprayed on components of the chopping device. The waste material exits the chopping device through a perforated sheet as clumps of material, which are then fed into an agglomerator, where they are agglomerated or compacted into strands of material. The temperature in the agglomerator is between 100 and 200 degrees C., i.e., below the melting point of the material of the film. The strands exiting the agglomerator are then cut to granule size.