Invention Grant
US09381727B2 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
有权
半导体刚性基板层压板和半透明刚性基板接合装置的制造方法
- Patent Title: Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
- Patent Title (中): 半导体刚性基板层压板和半透明刚性基板接合装置的制造方法
-
Application No.: US14233069Application Date: 2012-07-13
-
Publication No.: US09381727B2Publication Date: 2016-07-05
- Inventor: Hiroyuki Kurimura
- Applicant: Hiroyuki Kurimura
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: JP2011-156250 20110715
- International Application: PCT/JP2012/068021 WO 20120713
- International Announcement: WO2013/011970 WO 20130124
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B37/18 ; C03C27/10 ; G02F1/13 ; C09D4/00 ; C09J5/00 ; B32B38/18 ; C08F220/18 ; C08F222/10 ; B32B38/00

Abstract:
Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, the entire fixing agent spreading between the both translucent rigid substrates is cured every time the translucent rigid substrates are bonded.
Public/Granted literature
Information query