Invention Grant
- Patent Title: Flow path component, liquid ejecting apparatus, and method for manufacturing flow path component
- Patent Title (中): 流路部件,液体喷射装置以及流路部件的制造方法
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Application No.: US14168401Application Date: 2014-01-30
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Publication No.: US09381747B2Publication Date: 2016-07-05
- Inventor: Hajime Nakao
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-018384 20130201
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/14 ; B41J2/16

Abstract:
A flow path component includes a first flow path member that includes a first flow path, a second flow path member that includes a second flow path which communicates with the first flow path, a covering layer that coats a wall surface of the first flow path, and an adhesion layer that adheres the first flow path member and the second flow path member with each other and covers at least a part of an end portion of the covering layer. Also, at least a part of the first flow path of the first flow path member is configured as a pressure chamber that applies pressure to a liquid which is supplied.
Public/Granted literature
- US20140218446A1 FLOW PATH COMPONENT, LIQUID EJECTING APPARATUS, AND METHOD FOR MANUFACTURING FLOW PATH COMPONENT Public/Granted day:2014-08-07
Information query
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