Invention Grant
- Patent Title: Modular enclosure
- Patent Title (中): 模块化外壳
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Application No.: US14245607Application Date: 2014-04-04
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Publication No.: US09382038B2Publication Date: 2016-07-05
- Inventor: Bruce R. Conway , Hyo Chang Yun , Peter J. Dutton , Thomas D. Ratzlaff , Paul Craig Tally , James O'Keeffe , Erling Hansen
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: TYCO ELECTRONICS CORPORATION
- Current Assignee: TYCO ELECTRONICS CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: A47B87/00
- IPC: A47B87/00 ; B65D21/02 ; H05K5/00 ; H05K7/14

Abstract:
An enclosure includes a plurality of modular corner segments and a plurality of modular wall segments that connect together to at least partially define an internal compartment of the enclosure. The wall segments extending lengths between opposite free ends. At least a majority of the wall segments are fabricated from a polymer. Each corner segment includes opposite first and second receiver sockets that are each configured to receive a corresponding free end of a corresponding wall segment therein to connect the corner segment to the corresponding wall segments. At least a majority of the corner segments are fabricated from a polymer. The corner segments and the wall segments connect together to define the internal compartment of the enclosure.
Public/Granted literature
- US20150289389A1 Modular Enclosure Public/Granted day:2015-10-08
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