Invention Grant
- Patent Title: Insulating resin material and multilayer substrate
- Patent Title (中): 绝缘树脂材料和多层基材
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Application No.: US14425367Application Date: 2013-09-03
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Publication No.: US09382445B2Publication Date: 2016-07-05
- Inventor: Tatsushi Hayashi , Tomoki Kunikawa , Reona Yokota , Daisuke Tottori , Kazutaka Shirahase
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2012-196853 20120907; JP2013-030007 20130219
- International Application: PCT/JP2013/073636 WO 20130903
- International Announcement: WO2014/038534 WO 20140313
- Main IPC: H01B3/40
- IPC: H01B3/40 ; C09D163/00 ; H05K1/03 ; H05K3/46 ; C08K9/06

Abstract:
Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer.The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)−SP(B)) is not smaller than 0.5 but not larger than 3.5.
Public/Granted literature
- US20150210884A1 INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE Public/Granted day:2015-07-30
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