A release mechanism is actuated by the heat of a fire to electrically and mechanically disconnect electrical wiring from an electronic lock having a plastic housing. The electronic lock is mounted on a fire door and as it is heated by a fire on the opposite side of the fire door, mounts that hold the lock melt, releasing the electronic lock to drop away from the fire door and prevent ignition of the plastic housing. The release mechanism may use shape memory alloy wire to contract and disconnect a ribbon cable. Solder connectors may also be used to disconnect wires. Intumescent material that expands when heated is used to drive the lock mechanism away from the fire door and insulation is used to control the timing of melting.