Invention Grant
- Patent Title: Heat dissipation device having lateral-spreading heat dissipating and shunting heat conductive structure
- Patent Title (中): 具有侧向扩散散热和分流导热结构的散热装置
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Application No.: US13554075Application Date: 2012-07-20
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Publication No.: US09383146B2Publication Date: 2016-07-05
- Inventor: Tai-Her Yang
- Applicant: Tai-Her Yang
- Agency: Bacon & Thomas, PLLC
- Main IPC: F28F3/06
- IPC: F28F3/06 ; F21V29/74 ; F28D21/00 ; F21K99/00 ; F21Y101/02 ; F21V29/83

Abstract:
A heat dissipation device having lateral-spreading heat dissipating and shunting heat conductive structure, in which the central area of heat conductive interface of the heat dissipation device where a heat generating unit being disposed is installed with a close-loop shunting heat conductive structure, so the heat at the central area of the heat generating unit can be conducted to a distal heat dissipating segment for being dissipated to the exterior, thereby through working with the heat dissipation operation of the heat dissipation structure at the periphery of the heat generating unit and led to the distal heat dissipating segment, the temperature distribution at the central area and the peripheral area of the heat generating unit can be more even.
Public/Granted literature
- US20140022798A1 Heat dissipation device having lateral-spreading heat dissipating and shunting heat conductive structure Public/Granted day:2014-01-23
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