Invention Grant
- Patent Title: Connector, method of manufacturing same, and optical communication system
- Patent Title (中): 连接器，制造方法和光通信系统
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Application No.: US14011240Application Date: 2013-08-27
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Publication No.: US09383530B2Publication Date: 2016-07-05
- Inventor: Hiizu Ootorii
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2012-194258 20120904
- Main IPC: G02B6/26
- IPC: G02B6/26 ; G02B6/42 ; G02B6/32 ; G02B6/38
Abstract:
A connector includes: a fiber attachment path in which at least a part thereof has a height less than an outer diameter of an optical fiber; and a light-direction changing section provided at an end of the fiber attachment path.
Public/Granted literature
- US20140064662A1 CONNECTOR, METHOD OF MANUFACTURING SAME, AND OPTICAL COMMUNICATION SYSTEM Public/Granted day:2014-03-06
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