Invention Grant
- Patent Title: Thermal control apparatus and methodology
- Patent Title (中): 热控装置和方法
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Application No.: US13529202Application Date: 2012-06-21
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Publication No.: US09383789B2Publication Date: 2016-07-05
- Inventor: Jim J. Lin , Kiran B. Kattel
- Applicant: Jim J. Lin , Kiran B. Kattel
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Erik A. Heter
- Main IPC: G05D23/00
- IPC: G05D23/00 ; G05D17/00 ; G05D9/00 ; G05D5/00 ; G05D3/00 ; H01L35/00 ; H01L37/00 ; G01K1/00 ; G01K5/00 ; G01K3/00 ; G06F1/00 ; H03K3/42 ; H03K17/78 ; G06F1/20 ; H03K19/003 ; G06F1/32

Abstract:
Various embodiments of a thermal control methodology and apparatus are disclosed. In one embodiment, an integrated circuit includes one or more thermal sensors, comparison circuitry, and control circuitry. The comparison circuitry is configured to receive temperature readings from the one or more thermal sensors. The control circuitry is configured to reduce a performance level of one or more controlled subsystems responsive to the comparison circuitry determining that at least one temperature reading from the one or more thermal sensors exceeds one of one or more threshold values. A software-based thermal control mechanism may also execute concurrently with the apparatus.
Public/Granted literature
- US20130345892A1 Thermal Control Apparatus and Methodology Public/Granted day:2013-12-26
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