Invention Grant
US09383804B2 Method and system for reducing thermal load by forced power collapse
有权
通过强制倒塌减少热负荷的方法和系统
- Patent Title: Method and system for reducing thermal load by forced power collapse
- Patent Title (中): 通过强制倒塌减少热负荷的方法和系统
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Application No.: US13182940Application Date: 2011-07-14
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Publication No.: US09383804B2Publication Date: 2016-07-05
- Inventor: Brian Salsbery , Christopher Lee Medrano
- Applicant: Brian Salsbery , Christopher Lee Medrano
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Nicholas A. Cole
- Main IPC: G06F1/00
- IPC: G06F1/00 ; G06F1/04 ; G06F1/32 ; G06F1/20 ; G06F1/08

Abstract:
A system and method for reducing heat in a portable computing device includes clocking a processor such that it is provided with a full frequency over time t0 to t1. A timer is set to trigger a forced power collapse (“FPC”) that removes all power to the processor from time t1 to time t2. At time t2, the processor may be awakened such that it can resume processing at the full frequency. Advantageously, during the FPC, no leakage power (“PL”) is consumed by the processor between t1 and t2. The result is that the processor averages the same processing efficiency over time t0 to t2 as it otherwise would have if a reduced frequency had been provided to it. However, because no PL was consumed during the FPC, the generation of heat between time t1 and t2 that is related to PL is avoided.
Public/Granted literature
- US20130019120A1 METHOD AND SYSTEM FOR REDUCING THERMAL LOAD BY FORCED POWER COLLAPSE Public/Granted day:2013-01-17
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