Invention Grant
- Patent Title: Electrically conductive magnetic shield laminate structure for contact recording sensor
- Patent Title (中): 用于接触记录传感器的导电磁屏蔽层压结构
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Application No.: US14752931Application Date: 2015-06-27
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Publication No.: US09384764B1Publication Date: 2016-07-05
- Inventor: Robert G. Biskeborn , Calvin S. Lo , Andrew C. Ting
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Zilka-Kotab, PC
- Main IPC: G11B5/11
- IPC: G11B5/11 ; G11B5/39 ; G11B5/40 ; G11B5/008

Abstract:
In one general embodiment, an apparatus includes a magnetic sensor structure, a magnetic shield having at least one laminate pair comprising a magnetic layer and an electrically conductive nonmagnetic layer, and a nonmagnetic spacer layer between the sensor structure and the magnetic shield. In another general embodiment, an apparatus includes a magnetic tunnel junction sensor structure, and a magnetic shield having at least two laminate pairs, each pair comprising a magnetic layer and an electrically conductive nonmagnetic layer. A deposition thickness of the nonmagnetic layer in each laminate pair is about 10% or less of a total deposition thickness of the laminate pair.
Information query
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