Invention Grant
US09384876B2 Chip resistor, mounting structure for chip resistor, and manufacturing method for chip resistor
有权
片式电阻器,片式电阻器的安装结构以及片式电阻器的制造方法
- Patent Title: Chip resistor, mounting structure for chip resistor, and manufacturing method for chip resistor
- Patent Title (中): 片式电阻器,片式电阻器的安装结构以及片式电阻器的制造方法
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Application No.: US14350672Application Date: 2012-10-12
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Publication No.: US09384876B2Publication Date: 2016-07-05
- Inventor: Torayuki Tsukada , Kentaro Naka
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2011-226646 20111014
- International Application: PCT/JP2012/076481 WO 20121012
- International Announcement: WO2013/054898 WO 20130418
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H01C7/00 ; H01C17/242 ; H01C17/00 ; H01C17/02 ; H01C17/065

Abstract:
A chip resistor includes a first electrode 1, a second electrode 2, a resistor portion 3, a first intermediate layer 4 connected to the first electrode 1 and the resistor portion 3, a second intermediate layer 5 connected to the second electrode 2 and the resistor portion 3, a coating film 61 covering the first electrode 1, and oxides existing in the first intermediate layer 4. The coating film 61 is made of a material having a higher absorptance of a laser beam of a predetermined wavelength than that of the material forming the first electrode 1. The oxides are oxides of the material forming the coating film 61.
Public/Granted literature
- US20140247108A1 CHIP RESISTOR, MOUNTING STRUCTURE FOR CHIP RESISTOR, AND MANUFACTURING METHOD FOR CHIP RESISTOR Public/Granted day:2014-09-04
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