Invention Grant
- Patent Title: Magnetic multilayer structure
- Patent Title (中): 磁性多层结构
-
Application No.: US14155552Application Date: 2014-01-15
-
Publication No.: US09384879B2Publication Date: 2016-07-05
- Inventor: Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Louis Percello
- Main IPC: H01L29/82
- IPC: H01L29/82 ; H01F7/02 ; H01L27/06 ; H01L49/02
Abstract:
A mechanism is provided for an integrated laminated magnetic device. A substrate and a multilayer stack structure form the device. The multilayer stack structure includes alternating magnetic layers and diode structures formed on the substrate. Each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by a diode structure.
Public/Granted literature
- US20150200231A1 MAGNETIC MULTILAYER STRUCTURE Public/Granted day:2015-07-16
Information query
IPC分类:
