Invention Grant
- Patent Title: Dielectric composition to be sintered at low temperature, multilayer ceramic electronic component containing the same, and method of manufacturing the multilayer ceramic electronic component
- Patent Title (中): 在低温下烧结的电介质组合物，含有该介电组合物的多层陶瓷电子部件以及多层陶瓷电子部件的制造方法
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Application No.: US14258969Application Date: 2014-04-22
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Publication No.: US09384894B2Publication Date: 2016-07-05
- Inventor: Jong Bong Lim , Seok Hyun Yoon , Doo Young Kim , Sang Huk Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0012381 20140204
- Main IPC: C04B35/468
- IPC: C04B35/468 ; H01G4/12 ; H01G4/30
Abstract:
A dielectric composition to be sintered at low temperature may include BaTiO3 as a major component; and (1-x)Li2O-xCuO as a minor component, wherein x is 0.1 to 0.9, and the minor component is contained in a content of 0.1 mol % to 2.0 mol % based on 100 mol % of the major component.
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