Invention Grant
- Patent Title: Automatic matching unit and plasma processing apparatus
- Patent Title (中): 自动匹配单元和等离子体处理装置
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Application No.: US13034331Application Date: 2011-02-24
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Publication No.: US09384945B2Publication Date: 2016-07-05
- Inventor: Mitsutoshi Ashida
- Applicant: Mitsutoshi Ashida
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2010-042049 20100226
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01J37/32

Abstract:
In an automatic matching unit, a controller includes a first and a second matching algorithm. The operating point Zp is moved stepwise toward the matching point Zs with a relatively large pitch by using the first matching algorithm. Further, when the operating point Zp is within the outer proximity range, the operating point Zp is moved stepwise toward the matching point Zs with a relatively small pitch by using the second matching algorithm. In the second matching algorithm, the operating point Zp is moved close to the third reference line TC1S or TC2S perpendicular to the first or second reference line C1S or C2S along, e.g., the route Zp(7)→Zp(8)→Zp(9) on the impedance coordinates. The coordinates of the operating point Zp(9) reaches an available quasi-matching point ZB extremely close to the origin O (the matching point Zs).
Public/Granted literature
- US20110209827A1 AUTOMATIC MATCHING UNIT AND PLASMA PROCESSING APPARATUS Public/Granted day:2011-09-01
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