Invention Grant
US09384948B2 Hammerhead TCP coil support for high RF power conductor etch systems
有权
锤头TCP线圈支持高RF功率导体蚀刻系统
- Patent Title: Hammerhead TCP coil support for high RF power conductor etch systems
- Patent Title (中): 锤头TCP线圈支持高RF功率导体蚀刻系统
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Application No.: US13924477Application Date: 2013-06-21
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Publication No.: US09384948B2Publication Date: 2016-07-05
- Inventor: Maolin Long , Alex Paterson
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00 ; H01L21/306 ; H01J37/32

Abstract:
The chamber, having a ceramic window disposed in a ceiling of the chamber is provided. Included is a ceramic support having a plurality of spokes that extend from a center region to an outer periphery, and each of the spokes include a hammerhead shape that radially expands the ceramic support in a direction that is away from an axis of a spoke. Also included is a plurality of screw holes disposed through the ceramic support. The plurality of screw holes defined to enable screws to connect to a TCP coil having an inner and outer coil. The outer coil is to be disposed under the hammerhead shape of each of the spokes, and a radial gap is defined between each of the hammerhead shapes. The radial gap defines a non-continuous ring around the outer coil. A plurality of screws are disposed through the screw holes for attaching the TCP coil.
Public/Granted literature
- US20140367045A1 Hammerhead TCP Coil Support for High RF Power Conductor Etch Systems Public/Granted day:2014-12-18
Information query
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