Invention Grant
- Patent Title: Semiconductor component of semiconductor chip size with flip-chip-like external contacts
- Patent Title (中): 半导体元件半导体芯片尺寸采用倒装芯片外接触
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Application No.: US13038577Application Date: 2011-03-02
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Publication No.: US09385008B2Publication Date: 2016-07-05
- Inventor: Helmut Kiendl , Horst Theuss , Michael Weber
- Applicant: Helmut Kiendl , Horst Theuss , Michael Weber
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE10333841 20030724
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.
Public/Granted literature
- US20110147930A1 Semiconductor Component of Semiconductor Chip Size with Flip-Chip-Like External Contacts Public/Granted day:2011-06-23
Information query
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