Invention Grant
US09385011B2 Apparatus for processing semiconductor wafers, in particular for carrying out a polymers removal process step
有权
用于处理半导体晶片的装置，特别是用于进行聚合物去除工艺步骤
- Patent Title: Apparatus for processing semiconductor wafers, in particular for carrying out a polymers removal process step
- Patent Title (中): 用于处理半导体晶片的装置，特别是用于进行聚合物去除工艺步骤
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Application No.: US13440852Application Date: 2012-04-05
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Publication No.: US09385011B2Publication Date: 2016-07-05
- Inventor: Dario Tenaglia , Sebastiano Cali
- Applicant: Dario Tenaglia , Sebastiano Cali
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group PLLC
- Priority: ITMI2011A0646 20110415
- Main IPC: B08B7/04
- IPC: B08B7/04 ; B08B3/08 ; B08B5/00 ; B08B3/02 ; H01L21/67 ; B08B3/10 ; H01L21/02 ; H01L21/306 ; H01L21/677
Abstract:
An apparatus for processing semiconductor wafers includes at least a wet bench and an automatic handling system of a wafer carrier removably connected thereto. The wet bench includes a first processing tank, a second processing tank and a third processing tank, separated from one another, each processing tank being dedicated to a different chemical, as well as a special cleaning and drying tank for processing the automatic handling system when the wafer carrier has been removed.
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