Invention Grant
- Patent Title: Semiconductor processing system and program
- Patent Title (中): 半导体处理系统和程序
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Application No.: US12966429Application Date: 2010-12-13
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Publication No.: US09385016B2Publication Date: 2016-07-05
- Inventor: Teruo Nakata , Hideaki Kondo , Keita Nogi
- Applicant: Teruo Nakata , Hideaki Kondo , Keita Nogi
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Baker Botts L.L.P.
- Priority: JP2009-282995 20091214
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677

Abstract:
In a processing system of a linear tool in which plural carrying robots are arranged in carrying mechanical units to which processing modules are coupled and a processing target is delivered and received between the plural carrying robots, in the case where there are plural carrying routes on which the processing target is carried, the present invention provides a technique for determining the carrying route on which the highest throughput can be obtained.In the processing system of a linear tool, in the case where there are plural carrying routes on which the processing target is carried, the throughputs of the respective carrying routes are compared to each other, and the carrying route is determined by a unit for selecting the carrying route with the highest throughput.
Public/Granted literature
- US20110144792A1 SEMICONDUCTOR PROCESSING SYSTEM AND PROGRAM Public/Granted day:2011-06-16
Information query
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