Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14485927Application Date: 2014-09-15
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Publication No.: US09385057B2Publication Date: 2016-07-05
- Inventor: Tomoyuki Yoshino
- Applicant: SEIKO INSTRUMENTS INC.
- Applicant Address: JP
- Assignee: SII Semiconductor Corporation
- Current Assignee: SII Semiconductor Corporation
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2013-192964 20130918
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/28 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/495 ; H01L23/498 ; H01L21/48
Abstract:
A semiconductor flat package has a semiconductor chip, leads connected to the semiconductor chip, and an encapsulation resin covering the semiconductor chip and partially covering the leads. Outer end surfaces of the leads are exposed from the encapsulation resin and covered with a plated layer, and a side end surface of the plated layer and a side end surface of the encapsulation resin are flush with each other. A material with good solder wettability is formed at a lead cut portion of the semiconductor flat package, to thereby improve solder connection strength with a circuit board. A solder fillet is formed from the lead cut portion of the semiconductor package, to thereby enable adaptation of solder automatic visual inspection after mounting.
Public/Granted literature
- US20150076690A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-03-19
Information query
IPC分类:
