Invention Grant
US09385066B1 Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof
有权
具有模制激光器通过插入件的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof
- Patent Title (中): 具有模制激光器通过插入件的集成电路封装系统及其制造方法
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Application No.: US14282598Application Date: 2014-05-20
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Publication No.: US09385066B1Publication Date: 2016-07-05
- Inventor: In Sang Yoon , DeokKyung Yang , Sungmin Song
- Applicant: In Sang Yoon , DeokKyung Yang , Sungmin Song
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Wong & Rees LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L23/538
Abstract:
A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.
Information query
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