Invention Grant
- Patent Title: Packages having integrated devices and methods of forming same
- Patent Title (中): 具有集成设备的组件和形成其的方法
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Application No.: US14463396Application Date: 2014-08-19
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Publication No.: US09385073B2Publication Date: 2016-07-05
- Inventor: Chao-Yang Yeh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L25/07
- IPC: H01L25/07 ; H01L23/498 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L25/00 ; H01L23/00
Abstract:
An embodiment device package includes a discrete device, a first connector on a bottom surface of the discrete device, and a second connector on a top surface of the discrete device. The first connector bonds the discrete device to a first package component, and the second connector bonds the discrete device to a second package component.
Public/Granted literature
- US20160056100A1 Packages Having Integrated Devices and Methods of Forming Same Public/Granted day:2016-02-25
Information query
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