Invention Grant
- Patent Title: Semiconductor device, electronic device and method for fabricating the semiconductor device
- Patent Title (中): 半导体装置，电子装置及半导体装置的制造方法
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Application No.: US13972480Application Date: 2013-08-21
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Publication No.: US09385092B2Publication Date: 2016-07-05
- Inventor: Takumi Ihara
- Applicant: FUJITSU SEMICONDUCTOR LIMITED
- Applicant Address: JP Kanagawa
- Assignee: SOCIONEXT INC.
- Current Assignee: SOCIONEXT INC.
- Current Assignee Address: JP Kanagawa
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-208747 20120921
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/42 ; H01L21/50 ; H01L23/36 ; H01L23/498
Abstract:
A semiconductor device includes a substrate, a semiconductor chip mounted on the substrate, a plate-like member that is fixed on the semiconductor chip and has a thermal expansion coefficient different from that of the substrate, and a first adhesive that is provided between the substrate and the plate-like member, the first adhesive being connected to the plate-like member and separated from the substrate, or being separated from the plate-like member and connected to the substrate.
Public/Granted literature
- US20140084439A1 SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE Public/Granted day:2014-03-27
Information query
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