Invention Grant
- Patent Title: High breakdown N-type buried layer
- Patent Title (中): 高击穿N型埋层
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Application No.: US14555330Application Date: 2014-11-26
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Publication No.: US09385187B2Publication Date: 2016-07-05
- Inventor: Sameer P Pendharkar , Binghua Hu , Henry Litzmann Edwards
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Daniel Chan; Frank D. Cimino
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/225 ; H01L21/265 ; H01L21/266 ; H01L21/324 ; H01L29/167 ; H01L21/74

Abstract:
A semiconductor device has an n-type buried layer formed by implanting antimony and/or arsenic into the p-type first epitaxial layer at a high dose and low energy, and implanting phosphorus at a low dose and high energy. A thermal drive process diffuses and activates both the heavy dopants and the phosphorus. The antimony and arsenic do not diffuse significantly, maintaining a narrow profile for a main layer of the buried layer. The phosphorus diffuses to provide a lightly-doped layer several microns thick below the main layer. An epitaxial p-type layer is grown over the buried layer.
Public/Granted literature
- US20150311281A1 HIGH BREAKDOWN N-TYPE BURIED LAYER Public/Granted day:2015-10-29
Information query
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