Invention Grant
- Patent Title: Heterostructures for semiconductor devices and methods of forming the same
- Patent Title (中): 半导体器件的异质结构及其形成方法
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Application No.: US13895081Application Date: 2013-05-15
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Publication No.: US09385198B2Publication Date: 2016-07-05
- Inventor: Martin Christopher Holland , Georgios Vellianitis , Richard Kenneth Oxland , Krishna Kumar Bhuwalka , Gerben Doornbos
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/205 ; H01L29/20 ; H01L29/66 ; H01L29/78 ; H01L29/10 ; H01L29/778

Abstract:
Various heterostructures and methods of forming heterostructures are disclosed. A structure includes a substrate, a template layer, a barrier layer, and a device layer. The substrate comprises a first crystalline material. The template layer comprises a second crystalline material, and the second crystalline material is lattice mismatched to the first crystalline material. The template layer is over and adjoins the first crystalline material, and the template layer is at least partially disposed in an opening of a dielectric material. The barrier layer comprises a third crystalline material, and the third crystalline material is a binary III-V compound semiconductor. The barrier layer is over the template layer. The device layer comprises a fourth crystalline material, and the device layer is over the barrier layer.
Public/Granted literature
- US20140264438A1 Heterostructures for Semiconductor Devices and Methods of Forming the Same Public/Granted day:2014-09-18
Information query
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