Invention Grant
- Patent Title: Three dimensional antenna dome array
- Patent Title (中): 三维天线圆顶阵列
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Application No.: US13742227Application Date: 2013-01-15
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Publication No.: US09385416B2Publication Date: 2016-07-05
- Inventor: Gururaj Govindasamy , Hogan Lew , Prakash Guda , Stephen H. Strong , Thien T. Nguyen
- Applicant: Gururaj Govindasamy , Hogan Lew , Prakash Guda , Stephen H. Strong , Thien T. Nguyen
- Applicant Address: US CA Sunnyvale
- Assignee: ARUBA NETWORKS, INC.
- Current Assignee: ARUBA NETWORKS, INC.
- Current Assignee Address: US CA Sunnyvale
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H01Q1/42
- IPC: H01Q1/42 ; H01Q1/24 ; H01Q1/00 ; H01Q1/02 ; H01Q21/24 ; H01Q21/29
Abstract:
According to one embodiment of the invention, a wireless network device comprises wireless logic and a heat dissipation unit that encases the wireless logic. The heat dissipation unit includes an antenna dome array that comprises a top surface having a convex-shaped outer periphery with a plurality of antenna elements positioned along the outer periphery.
Public/Granted literature
- US20140197998A1 THREE DIMENSIONAL ANTENNA DOME ARRAY Public/Granted day:2014-07-17
Information query
