Invention Grant
- Patent Title: High density connector
- Patent Title (中): 高密度连接器
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Application No.: US14882833Application Date: 2015-10-14
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Publication No.: US09385455B2Publication Date: 2016-07-05
- Inventor: Kent E. Regnier , Patrick R. Casher , Michael Rowlands
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R12/70 ; H01R9/24 ; H01R12/72 ; H01R12/71 ; H01R13/652 ; H01R43/20

Abstract:
A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. A commoning member can connect ground tails to ground terminals. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.
Public/Granted literature
- US20160036147A1 HIGH DENSITY CONNECTOR Public/Granted day:2016-02-04
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